NIC Components Corp.NRSN Chip Resistor Arrays/Networks

Produktspezifikationen

• high density packaging offers significant space savings
• low profile
• Lower Production costs with less Placement (up to 8 resistors in one package)
• miniature
• standard footprints make conversions easy
• Suitable for Flow and Refl ow Soldering Processes
• super miniature size and low profile
• thick film resistor arrays